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Real Time Verification

Today's mask costs and manufacturing cycle times induce many sleepless nights for everyone on the product team. You might find yourself asking the questions: Are my simulation models correct this time? Do we need to respin another mask set and at what cost in time and money? If my design does not perform exactly to specifications, will we be able to meet the customers scheduled timeline? FIB-X's FIB circuit modification can help you sleep easier by testing your design improvements in a timely manner giving you the assurance that your design will operate to specification, thus reducing the chances of another respin and avoiding the costs of another mask set.

3D FIB-SEM Volume

FIB-X has aquired a Thermo Fisher Helios 660 FIB-SEM capable of 3nm xyz resolution of 3D volumes, 3D volume reconstruction and analysis using Thermo Fisher's perGeos software for Segmentation and Flow analysis among other analyses. It is installed in our Houston office. Contact us for pricing and special requests or to come by for a demo. click here for more info.

FIB-X Moving Maps (MM)

FIB-X has developed a new technique that bridges the gap between micron-scale MicroCT 3D analysis and nanometer-scale FIB-SEM 3D volume construction at reduced costs and efficiency. click here for more info.

Scanning Electron Microscopy (SEM)

FIB-X can obtain high resolution 2D SEM mosaic imaging over large areas to observe the pore systems and clay characteristics at the nanometer scale in unconventional reservoir samples. click here for more info.

Energy-Dispersive X-ray Spectrometry (EDS)

FIB-X can obtain elemental analysis on unconventional reservoir samples.

Sample Preparation for Backscattered Electron Imaging (Argon Ion Mill)

FIB-X can perform ion mill preparation on your unconventional reservoir samples.

Defect Analysis with EDS

Dual beam operation with insitu EDS for elemental anaylsis gives us the capability to help you identify process defects and contaminations in real time. Our technician has over 15 years experience in defect analysis and critical measurements.

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